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Find the Right Material for Your Application

Explore our versatile product lines, offering precision-engineered 3D printing materials in both rigid and flexible series, tailored to meet the diverse needs of modern manufacturing.
 
If we don't already have it, we can make it.
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Tailored 3D Printing Materials

NanoCubed™ features Tailored Nanocomposite Photopolymers for exponential performance. Rigid, flexible, and optical materials available. Tailored for end-use applications. SLA + Syringe Extrusion + Piezo Inkjet compatible.

 

 

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Additive Electronics Materials

Our comprehensive portfolio features a range of high-performance conductive, insulating, and functional specialty inks that seamlessly complement each other to allow for comprehensive printing of electronics.

Tailor-made to suit SLA and jettable technologies, our ever-expanding product line caters to the exacting demands of end-use applications. 

End-Use Application Focus

Understanding that the ultimate goal of printed electronics is to enhance real-world applications, we prioritize end-user functionality.

printed-circuit-board

Circuitry + Electronics Packaging

  • Multi-layer, multi-material printing
  • Rigid & Flexible substrates
  • Via thru-hold process
  • Fine Feature Detail Conductive performance
  • Solderability
displays

Displays + Touch Screens

  • 5b adhesion to substrates
  • Low-temperature sintering
  • Fine feature detail
  • Conductive performance
wiring-harness

Flexible Electronics + Wiring Harnesses

  • Multi-layer, multi-material printing
  • Fine feature detail
  • Conductive performance
  • Space and weight savings
  • Printed network vs. manual assembly
  • Potential to integrate into structure
printed-passive-circuitry

Passive Circuitry

  • Resistors, capacitors, and inductors printing capabilities
  • Inkjet resistors - less than 10% standard deviation
  • Inkjet capacitors - 2% maximum standard deviation
photovoltaic

Photovoltaics

  • Print silver conductive onto a Gallium Arsenide wafer
  • High-performance electrical data
  • Low-temperature process - sintering <120c
  • Fine feature printing ~50 um gaps
rfid

RFID + Sensors + Antennae

  • Multi-layer/ templating
  • Rigid and flexible substrates
  • Fine feature detail
  • Conductive performance
  • Solderability
semiconductor

Semiconductor Manufacturing

  • On-demand customization of electronic devices
  • Fewer materials and less energy
  • High throughput and rapid prototyping capabilities
  • Expanding design possibilities
  • Seamless integration of electronic components onto various substrates
wearables

Wearables

  • Multi-layer, multi-material printing
  • Conductive, touch, pressure printed circuits
  • Rigid or flexible substrates
  • Similar PC attributes
  • Medical, dental, fitness, and telecom devices
  • Automotive and Aerospace in-cabin sensors/controls
  • Wearable fabrics

Talk to an Expert Today

Please complete the form below and inform us of the specific application you have in mind for a custom-tailored formula suited to your product.

Let us help you formulate your next amazing 3D printing material.