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The ElectroJet™ Solutions transcend mere high-performing materials and cost-effective printer systems. Our comprehensive approach encompasses a myriad of processes meticulously designed to maximize the efficacy of materials, printers, and the ultimate benefits for end-users. By fostering strong partnerships with end-use customers, OEM partners, and other industry collaborators, we consistently gather and refine best practices, disseminating them through updated guidelines and cutting-edge product developments.

Pre-Printing Process

Preparing substrate surfaces for printing is crucial to ensure optimal results. Utilizing a lint-free wiper along with ethanol or IPA solvent effectively cleans the surfaces, promoting better adhesion during printing. Additionally, for enhanced adhesion, certain substrates may benefit from the application of C3-PR-3 Primer. Acting as a coupling and bonding agent rather than just a coating, this primer is applied in a single-direction wiping motion, with a short 30-minute drying time. Moreover, it can aid in the cohesion of multi-layer silver traces. Any residual primer can be easily cleaned from the substrate post-printing using a suitable cleaning solvent, further streamlining the process.

Printing Process: Two-layer PCB

The multi-layer/multi-material printing process offers numerous advantages. It involves the sintering of silver conductive ink using a heated platen in-line, followed by the UV curing of dielectric insulating ink with an LED lamp. This process allows for the addition of extra layers of each material as needed.

One key benefit is the ability to precisely control trace conductivity through print passes, meeting specific requirements. Additionally, dielectric material can serve as both a base layer primer and a top layer encapsulation, enhancing versatility and functionality in various applications.

Printing Process: Multi-Layer/Multi-Pass

A single layer of silver ink conductivity might encounter challenges due to surface roughness. However, employing multiple layers, or image copies, can effectively mitigate any peak/valley defects present in the initial layer. Moreover, increasing the thickness offers a significant reduction in resistance.

There are two modes of repeat printing available: X & Y multi-layer printing involves a complete overlay of the image with multiple layers, while X multi-pass printing repeats the print in the X-direction before the platen advances to the next Y position. This latter method is particularly advantageous for achieving high precision features, especially when the Y position shift could potentially affect trace accuracy.

For further enhancement in performance, when exceeding three layers at controlled widths, the utilization of Dielectric Templating becomes imperative.

Printing Process: Dielectric Base Layer

Dielectric inks serve as an advantageous primer base layer for substrates, offering numerous benefits. They excel in adhering to high surface energy substrates, promoting enhanced surface smoothness for better holdout and resolution of silver conductive traces. This improved surface quality contributes to heightened conductive efficiency in single-layer applications. Moreover, these inks exhibit excellent adhesion properties to both rigid and flexible substrates of various types. Specifically, Di-7 is recommended for use with rigid or flexible substrates, while Di-8 is ideal for flexible substrates, including those requiring multiple layers.

Printing Process: Security & Authentication

Our C3-SEC-7 Security Marking Ink offers the advantage of invisibility, only visible under UV light. Utilizing the ElectroUV3D printer, it follows the same process as dielectric inks, ensuring seamless integration. Its compatibility with C3-DI-8 is notable, as both exhibit similar transparency under visible light. This ink is ideal for security marking applications, providing covert protection for logos, text, and other elements.

Post-Printing Process

Solder mask application is crucial for safeguarding printed circuits, shielding them against oxidation and averting solder bridges between pads. Its widespread adoption in reflow soldering processes underscores its effectiveness. Implemented through techniques akin to those employed in printing dielectric ink with printers like ElectroUV3D, this procedure not only enhances conductivity but also facilitates resistance testing and post-cure optimization for improved performance. Additionally, it fosters a multilayer, multi-pass effect, further augmenting its utility in circuit protection and optimization.