ElectroJet™ materials showcase impressive performance, empowering end-users to embrace advanced manufacturing concepts seamlessly, all while upholding the objectives of miniaturization, waste reduction, and optimizing total cost of ownership (TCO). Our comprehensive portfolio features a range of conductive, insulating, and functional specialty inks that seamlessly complement each other. Specifically designed to synergize, each material enhances the printing process and boosts the functional performance of the end product.
ElectroJet ink encompasses all key considerations: nano-particle, UV curable dielectric, carbon-based, and particle-free options, ensuring it meets all requirements effortlessly.
Conductive performance
Sintering temperature and time
Ensuring printer process compatibility and reliability
Compatibility with dielectric materials
Enhanced physical resilience and adaptability for various applications
Dielectric constant performance
Improved compatibility with the printer's UV curing process.
Enhanced compatibility with conductive materials
Performance encapsulation is the seamless
Enhanced primer adhesion to the substrate.
Conductive Performance near the bulk of silver conductivity – resistivity in the range of 10-8 Ω•M
Sintering Efficiency as low as 80ºC in minutes
Jetting Reliability particle-free formulation won't clog heads and does not require recirculation
Printing Compatibility viscosity tuned for ElectroJet™ brand ElectroUV3D™ printer or other industry-branded heads and printers such as Ricoh, Konica-Minolta, Fuji, and Xaar.
Ethanol-based silver conductive Ink
Low sintering temperature particle-free silver conductive material formulated for piezo inkjet heads
Range 10-8 Ω•M
80
20 ml | 50 ml | 100 ml
Ethanol-based silver conductive Ink
Low sintering temperature particle-free silver conductive material formulated for piezo inkjet heads
Range 10-8 Ω•M
80
20 ml | 50 ml | 100 ml
Copper conductive Ink
Copper conductive material formulated for piezo inkjet heads
2 -10 x 10-7 Ω•M*
180
20 ml | 50 ml | 100 ml
Dielectric performance insulation between conductive layers.
Adhesion promotion may be applied as a base layer to optimize adhesion to low surface energy substrates.
Print enhancements provide optimal surface properties for conductive ink holdout and image resolution.
Protective encapsulation protects conductive traces from moisture, chemicals, and physical abrasion of the external environment.
Printing Compatibility viscosity tuned for ElectroJet brand ElectroUV3D printers or other industry brand heads and printers such as Ricoh, Konica-Minolta, Fuji, and Xaar.
UV-curable dielectric insulating ink
Insulation building material with excellent adhesion promotion for substrates and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
UV-curable dielectric insulating ink
Insulation building material with excellent adhesion promotion for substrates and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
High-performance dielectric ink used in conjunction with C3-DI-7
Makes DI-7 three times stronger, withstand much higher temperatures, dramatically small Coefficient of thermal expansion (CTE) with a lower dielectric constant
N/A
UV
250 ml | 500 ml | 1 liter | 5 liters
UV curable, low loss, high-frequency dielectric insulating ink for the ElectroUV3D inkjet printer
UV-curable dielectric insulating ink
High-frequency insulating / building material with excellent adhesion promotion for substrates and compatibility with silver conductive material
N/A
UV
250 ml | 500 ml | 1 liter | 5 liters
UV-curable dielectric insulating ink
Transparent insulating/building material with excellent insulating properties for higher voltage and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
UV-curable dielectric insulating ink
Transparent insulating/building material with excellent insulating properties for higher voltage and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
UV-curable dielectric insulating ink
Insulation/building material for interlayer insulation optimized for flexible circuitry and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
UV-curable dielectric insulating ink
Insulation/building material for interlayer insulation optimized for flexible circuitry and compatibility with silver conductive material
3.3 x 1013 Ω•cm
UV
250 ml | 500 ml | 1 liter | 5 liters
Primer serves as a coupling agent between the substrate surface and conductive ink
Storage Solution maintains the performance and longevity of conductive inkjet heads for consistent printing results over time
A direct chemical adhesion primer solution for LSE surface preparation
Substrate primer
Specialized direct chemical adhesion primer solution for high-surface energy substrates optimized for direct print silver conductive ink
N/A
N/A
250 ml
An overnight storage solution for conductive inkjet heads
Storage solution
Maintains the performance and longevity of conductive inkjet heads for consistent printing results over time
N/A
N/A
Save 15% on yearly plan!
$1216 /month
All Basic features, plus:
$129149 /month
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